结合板
High-performance six-layer PCB with precise impedance control and immersion gold surface finish, designed for advanced electronic applications. We provide reliable quality, competitive pricing, and professional customization services to meet your specific project requirements.
- Precise impedance control (±10%)
- Immersion gold surface finish, excellent solderability
- High reliability for high-speed and high-frequency applications
- Strict quality control and 100% electrical testing
- Support custom specifications and small/medium batch production
结合板
正常价格
$0.00
销售价格
$0.00
正常价格
单价
产品详情
| 层数 | 6 层 | 基材 | FR-4 (TG 150/170) / 高TG材料 |
| 表面处理 | 沉金 (ENIG) | 阻抗控制 | 是 (±10%) |
| 板厚 | 1.6 mm (可定制) | 最小线宽/线距 | 3 mil / 3 mil |
| 铜厚 | 外层 1 oz，内层 1 oz | 板尺寸 | 最大 500 mm × 500 mm |
| 最小孔径 | 0.2 mm | 应用领域 |
通信设备、工业控制、 汽车电子、消费电子等。 |
产品亮点
